Flip chip assembly allows for a direct or shorter signal path between the chip and the system. Flip chip assembly is accomplished by depositing solder bumps to the active surface of the chip, either in a peripheral (on the outer edge of the chip) array or an area array pattern (over the entire active surface of the chip). These solder bumps are then reflowed onto a package or printed circuit board. Assembly is accomplished in a reflow furnace using a nitrogen atmosphere and flux. Contact Air Products at 800-654-4567 to see how we can help you improve your reflow process.